2018 China Electronic Industry Product Packaging Summit Conference

At 1:30 p.m. on October 20th, the "2018 China Electronic Industry Product Packaging Summit Forum" was held as scheduled in Shunde, a core city of China's electronic industry's household appliances and packaging industry. It was hosted by the Electronic Industry Packaging Technology Committee of the China Packaging Association and organized by Foshan Shunde Hui Meizhuang Materials Industrial Co., Ltd. More than 230 elite representatives from terminal enterprises, innovative packaging companies, relevant department leaders, renowned entrepreneurs, packaging experts, university professors, various electronic product manufacturing enterprises, various e-commerce platforms, and media representatives attended this annual event.

Opening Remarks:

In her speech, the leader of the China Packaging Association expressed her high recognition of the work of the Electronic Industry Packaging Technology Committee of the China Packaging Association and gave requirements and expectations for the future work of the committee.

Mr. Ye Baizhang, the executive vice president and secretary-general of the Electronic Industry Packaging Technology Committee of the China Packaging Association, delivered a speech on the significance, purpose, and development direction of this conference. He warmly welcomed everyone for attending the forum despite their busy schedules and expressed sincere gratitude on behalf of the Electronic Industry Packaging Technology Committee of the China Packaging Association to all the friends who have been concerned and supported the forum and the healthy development of China's electronic industry product packaging. Then, Mr. Ye Baizhang announced the official opening of this summit!

This summit was chaired by Mr. Huang Shengwen, the deputy director of the Electronic Industry Packaging Technology Committee of the China Packaging Association. The purpose of this conference was to gather both the supply and demand sides of electronic industry product packaging to build a platform, jointly discuss packaging innovation trends and directions, provide intellectual support and direction guidance for terminal packaging innovation, and provide product technology development orientation for suppliers, leading the innovation and development of China's electronic industry product packaging.

The main leaders and guests attending the opening ceremony of the forum included:

1. Vice President of the China Packaging Association, Deputy Director of the National Packaging Standardization Technical Committee, and Secretary-General: Ms. Wang Li;

2. Executive Vice President and Secretary-General of the Electronic Industry Packaging Technology Committee of the China Packaging Association: Mr. Ye Baizhang;

3. President of the Shunde Private Enterprise Development Chamber of Commerce and General Manager of Foshan Shunde Hui Meizhuang Materials Industrial Co., Ltd.: Mr. Tan Bingwei;

4. Deputy Director of the Electronic Industry Packaging Technology Committee of the China Packaging Association: Mr. Huang Shengwen;

5. Deputy Minister of the China Packaging Industry Development Department: Ms. Wang Weihong;

6. Deputy Minister of the National Quality Standards Department: Ms. Ma Chunxia;

7. Secretary-General of the Guangdong Packaging Technology Association: Mr. Zhu Zhiwei;

8. Director of the Shunde Quality and Technical Supervision Standards and Coding Office: Ms. Ouyang Dan.

Presentation:

Directly Addressing the Cutting-edge Technologies in Electronic Packaging Industry

Entering the presentation session, Mr. Huang Shengwen, the Deputy Director of the China Packaging Association Electronic Committee, began with "Review and Outlook of Major Packaging Events of the Year", scanning the Chinese electronic industry packaging in recent years from a broad industry perspective and introducing some major events and new technologies and trends in packaging. This speech received rounds of applause from all the attendees.

During this session, Mr. Huang Shengwen also highlighted the environmentally friendly modular boxes innovatively developed by Jupai Fenxing Packaging Technology Co., Ltd.

The successful debut of the modular boxes means that Jupai Fenxing Packaging Technology Co., Ltd. has closely followed the trends of the environmental packaging industry and has received widespread attention and recognition within the industry.

Next, Professor Xu Chengyong from Taiwan University of Science and Technology delivered a speech titled "From Human Flow, Business Flow, and Logistics to the Development Flow of AI in the Packaging Market". He clarified the wonderful prospects of current AI automated packaging systems and the cutting-edge technologies at home and abroad. The audience listened attentively.

Mr. Liu Zhaoping, the Packaging Module Resource Director of Haier Group, delivered a speech titled "Exploring the Modularization of Household Appliance Packaging in the Internet of Things Era", allowing all the guests to appreciate the great achievements of Haier Group in innovation exploration and the wonderful prospects of the packaging industry in the future.

Mr. Ma Zhen from Wuxi Chengde Honeycomb Machinery Factory presented a video of the "New Generation Fully Automatic Honeycomb Production Line" to the audience. In terms of production capacity, vehicle speed, and labor saving, it has reached the international advanced level.

Jenny, the Marketing Director of Air Packaging Solution Leaders, explained the "Ji-Zhi Reduction Environmental Packaging Solution" by Elber to the audience, capturing the attention of many guests with her mobile phone screens.

Xiao Xiao, a teacher from Guangdong Midea Refrigeration Equipment Co., Ltd., delivered a speech titled "Discussion on Cost Optimization of Household Appliance Packaging", guiding the attendees on the direction for the household appliance packaging industry.

Gao Feng, the Senior Marketing Director of Shenzhen Yunchuang Culture Technology Co., Ltd., delivered a speech titled "Packaging Solutions under Industrial Internet", allowing the packaging enterprises in the process of transformation and upgrading to see a new direction.

Mr. Sun Xiaogang from Ningbo Yujia Packaging delivered a speech titled "Sustainable Logistics Plastic Packaging Solution", providing the attending end-user guests with another option for packaging material selection.

On the second day of the "2018 China Electronic Industry Product Packaging Summit", the presentation continues with great excitement!

Teacher Zhang Huizhong from Suzhou Daqi Packaging delivered a report titled "Cognition and Exploration of 'Dangerous Packaging Boxes' Used in Lithium Batteries". Among the 3,495 dangerous goods specified in the GB12268-2012 "Dangerous Goods Name List", most lithium batteries are classified as medium-risk II-class dangerous goods, and the corresponding packaging containers are II-class dangerous goods packaging. Zhang Huizhong imparted the technical key points of lithium battery packaging without reservation to the conference, benefiting the attendees greatly.

General Manager He Xian of Qidai Instruments shared "Ensuring the Accuracy of Paper Box Test Data". The elimination of the original paper weight, the calculation of the crease rate, the usage skills of digital moisture testing instruments, the relationship between compressive strength curves and stacking strength, the testing skills for moisture resistance of paper boxes, and the detection methods of various instruments.

Mr. He Xianpei from Foshan Shunde District Tepo Gao Industrial Co., Ltd. shared "The Development Trend of Moisture-proof Packaging Industry". Tepo Gao's Absorption Dominant Adsorption Desiccant can effectively absorb three times its own weight of moisture, effectively balancing moisture-proof effect and cost. As a niche industry, Tepo Gao relied on innovation and internet marketing to rapidly grow into a leading enterprise in this specialized field.

Professor Zhong Yunfei from Hunan University of Technology delivered a speech titled "Innovate Your Products and Packaging - Collaboration". He presented different insights on innovation, pointing out that innovation is not only about developing new products and markets, but also establishing new systems. In the internal innovation collaboration within an enterprise, it should include the collaboration of technical elements with market elements, technical elements with organizational elements, and technical elements with cultural elements.

Xia Zirong, the general manager of Wuhu Asia-Pacific General Pallet Packaging Co., Ltd., shared "New Pallet Technology and Promotion Plan". Asia-Pacific General Pallet belongs to a new type of wood-plastic molded material that is environmentally friendly, sustainable, and recyclable. It has features such as moisture-proof, mold-proof, pest-proof, no nails, easy cleaning, no need for fumigation for export, unaffected by weather conditions, durable, recyclable and reusable, and has good waterproof performance. It can be soaked in water for a long time without glue or formaldehyde.

Tao Liangyi, an engineer from Guangdong Midea Kitchen and Bathroom, shared "An Attempt of Heat-Shrink Packaging in Domestic Gas Stove Packaging". Tao Liangyi analyzed that in the past two years, due to the skyrocketing price of paper, electronic industrial enterprises decided to try "cold stretching film or heat shrink film to replace carton packaging". Under UV-B ultraviolet light, monitoring mechanical properties and elongation rate shows a decay phenomenon. When placed outdoors, there is a seepage phenomenon. This led to the slow promotion of this plan. Tao believes that this trend is inevitable. The best packaging is no packaging, and the best packaging is a transfer container.

Su Yuanzhen, the general manager of Jiangzhiyuan Industrial Co., Ltd., shared "Thoughts on Packaging Greening". He expressed deep concern about the misconceptions of degradable and reduction in plastic packaging currently. He believes that the greening of plastic packaging should gradually shift from biodegradation to recycling and classification.

Shi Qiong, the regional manager of Kascat (Xiamen) Forklift Equipment Co., Ltd., gave a speech on "A New Type of Ultra-Thin Rapid Logistics Pallet System". He described the highlights of the pusher in the logistics system. If this plan is promoted in the electronic industry, it will improve the damage of goods and save a lot of logistics costs. This solution is very worthy of promotion! Mr. Shi also detailed the application situations of various new sliding pallets on the market.

Xia Jianjun, the designer of TCL Electronics Holdings Co., Ltd., gave a report on "Application and Innovation of Packaging Printing". Currently, the demand for color boxes for home appliances is increasing, but the cost pressure is high, the order quantity is decreasing, and the supply cycle is long, which brings great pressure to the supply chain. He compared the three printing processes of color boxes and their costs and gave good suggestions. In addition, the report also analyzed the current status of energy efficiency label printing process improvement, film-based printing process improvement, and the current situation of electronic manuals and E-POP.

Su Hongbo, the general manager of Hangzhou Pinxi Technology Co., Ltd., gave a report on "Paper Packaging Intelligent Detection and Quality Management Informationization". Su pointed out that currently, electronic, e-commerce, cosmetics, and electrical appliance industries are all facing challenges in cost and quality. The pain points of packaging enterprises have not been alleviated at all. Therefore, packaging printing enterprises should obtain greater benefits through detection data. As a result, the detection work of enterprises has exploded. The quality management information system launched by Pinxi can bring new solutions to the information management, cloud platform, and data monitoring of enterprises.

Zhang Xiongfeng, Mr. Zhang from Gree Electric Appliances Co., Ltd., gave a presentation on "Discussion on the Application of Air Cushion Packaging in Air Conditioners". He provided a packaging solution analysis for the electronic industry. Air packaging is the pioneer of the new era of EPS, suitable for all products in the electronic industry to actively explore and apply.

Wang Guofu, the designer from Guangdong Midea HVAC Equipment Co., Ltd., gave a sharing on "Micro Innovation Design for Electronic Industry Packaging". He introduced corresponding innovative design solutions from six aspects: improvement of the experience of paper box structure, design of auxiliary transportation straps for water heaters, secondary utilization of the base feet of the outdoor unit, simple pallet base feet, zero packaging water tank scheme design, and modular design and integrated transportation concept of home appliance packaging. This brought great inspiration to the product innovation of the packaging printing industry.

Chen Qiang, the designer from ZTE, gave a report on "Sharing of Simulation Analysis Application in Packaging Design". Using simulation analysis tools to solve various difficult problems of cargo damage in packaging design, it is worth reference and discussion for industry designers.

Wang Shaoli, a designer from Shenzhen Lanhe Technology Co., Ltd., delivered a report titled "How Can E-commerce Products Meet the Demand for Reducing Green Packaging?". Through vivid examples of sales packaging and courier packaging, she proposed constructive suggestions centered around the design of reduced packaging.

Zhang Ying, a designer from Zhuhai Gree Electric Appliance Co., Ltd., gave the closing speech titled "The Development Trends of Small Household Appliance Transportation Packaging". She first envisioned the future prospects of small household appliances, believing that the small appliance market will still have a bright future. She pointed out that there are still many pain points in the packaging of small household appliances and analyzed the causes of these problems. She pointed out some development trends for the future packaging of small household appliances and it is quite worthy for the packaging printing industry to learn and refer to.

Mr. Huang Shengwen, the deputy director of the China Electronic Industry Packaging Technology Committee and the academic leader of the China Electronic Industry Packaging Expert Team, made a concluding speech. He summarized the highlights and shortcomings of this forum and encouraged the packaging design teams of all enterprises and all packaging designers to delve deeply into professional depth, build a solid professional foundation, communicate more, cooperate more, and share more. He hoped that the research, supply, demand, and design parties in the industry would collaborate and jointly promote the development of the industry.